A Replacement Partoil mixture, improved thermal filler properties and increased particle deagglomeration, dispersal and density enhance CΘramique 2's thermal performance and overall stability.

Ceramique 2 is engineered to not separate, run, migrate, or bleed.

CΘramique 2 does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.

2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.